Why so few win10 updates now?

On 02/03/17 17:03, micky so wittily quipped:
In alt.comp.os.windows-10, on Sat, 04 Feb 2017 11:16:20 +1100, Peter
Jason wrote:

They used ro come thru thick & fast; now hardly at all.

Because now win10 is perfect.


HA HA HA HA HA HA HA HA! That's a GOOD one, heh!

--
your story is so touching, but it sounds just like a lie
"Straighten up and fly right"

Big Bad Bob wrote:
On 02/03/17 16:16, Peter Jason so wittily quipped:
They used ro come thru thick & fast; now hardly at all.


AND you are COMPLAINING???

Most people are worried about a busted Windows Update.
If you don't see activity, you assume it's busted again.

Paul

On Sat, 4 Feb 2017 07:39:29 -0600, Andrew Rossmann wrote in message:
:

On Sat, 04 Feb 2017 11:16:20 +1100, Peter Jason wrote in message:
:

They used to come thru thick & fast; now hardly at all.

Most likely the holidays put a hold on some updates that were not
critical. It will probably start to pick back up after this month's
Patch Tuesday.

The next Patch Tuesday will be on February 14, 2017. . . .
Some half-jokingly refer to the day after Patch Tuesday
as Crash Wednesday, referring to the troubles that
sometimes accompany a computer after the patches
are installed.
--Tim Fisher
_Lifewire.com_ [January 12, 2017], "Patch Tuesday"

https://www.lifewire.com/patch-tuesday-2625783

On 02/04/17 05:21, Paul so wittily quipped:
If the chip is soldered down, if your storage
fails, the whole computer heads for the landfill.
Unless you have a hot air station, can heat that
chip up and remove it.

I usually remove QFP chips (assuming it's that, and not QFN) by clipping
all of the leads with a really good set of wire cutters [designed for
teensy little wires] and then removing all of the leftovers with a
solder sucker and/or wick. QFN and 'ball grid' is difficult and would
probably require the hot air solder station, assuming it's possible at
ALL. If I were handed a BGA mount to remove I'd probably say "yeah,
right" and "get another board".

Big Bad Bob wrote:
On 02/04/17 05:21, Paul so wittily quipped:
If the chip is soldered down, if your storage
fails, the whole computer heads for the landfill.
Unless you have a hot air station, can heat that
chip up and remove it.

I usually remove QFP chips (assuming it's that, and not QFN) by clipping
all of the leads with a really good set of wire cutters [designed for
teensy little wires] and then removing all of the leftovers with a
solder sucker and/or wick. QFN and 'ball grid' is difficult and would
probably require the hot air solder station, assuming it's possible at
ALL. If I were handed a BGA mount to remove I'd probably say "yeah,
right" and "get another board".

The eMMC is a ball grid array, but it isn't a full
grid. You could remove it with hot air. Now, who
do you know, with a hot air station, that'll do work
for you ?

One issue is clearance. It's one thing to say "hot air",
quite another for the assembly you've got, to have space
to fit the head. They don't have to make the products
so they are repairable. We had clearance requirements
around our BGAs, so you could repair them.

Paul